来源：http://www.jnhjgs.cn 发布时间：2021-04-12 15:22:18 点击：
Injection mold plays an important role in modern industrial production, and its quality directly determines the quality of products. However, in the process of production and application of injection mold, various failures often occur, which wastes a lot of manpower and material resources, and affects the production progress and economic benefits of mold processing. Therefore, improving the injection mold and increasing the service life of the mold is an urgent problem to be solved.
Easy to operate process plan: the standard module is used as the initial processing basis of the mold, and the machining is completed in two processes: rough and fine. 1.5-2mm is reserved for rough machining, and the internal stress is eliminated by heat treatment before finishing machining, so as to reduce the internal stress of machining to a low level, so as to maintain the long-term dimensional stability of the module. Die standardized production has been widely promoted, and die base is widely used. Before entering the factory, the mold base is set according to the user's requirements, and the guide device has been accurately processed in place. Even if there is internal stress deformation in machining, the internal stress of workpiece can not be eliminated by heat treatment. In order to meet the requirements of assembly accuracy, the scheme of machining to correct geometric deformation is not rigorous in theory. Although the obvious geometric deformation has been corrected, the displacement caused by the guide device has not been corrected due to the effect of machining stress, and the internal stress of metal does not disappear due to the mechanical correction of geometric deformation.
Due to the influence of various uncertain factors and its own reasons, the residual internal stress of the module is always released, which leads to the deformation of the dynamic and fixed die. With the deformation of the moving and fixed die module, the sealing surface changes irregularly, and the flying spikes increase gradually. On the other hand, it appears in the ejection mechanism. The movement of ejector rod is smooth without side wall friction. With the increase of module deformation, the side wall friction of ejector rod gradually occurs until the phenomenon of thermal bonding occurs. The process of internal stress release is the process of module secondary deformation. The larger the stress coefficient, the faster the release and the faster the die failure.